恩萊特科技贊助「寬能隙元件技術暨未來應用趨勢線上研討會 」，與業界專家共同探討寬能隙元件的關鍵技術與未來應用，邀您一同參與。 活動時間 2022年05月26日 10:00 a.m.（台北時間） 研討會簡介 近期引起眾多話題的寬能隙(WBG)元件...

By Shelly Stalnaker For years, decades even, the semiconductor industry has lived by the process node, which was originally named by its...

Using Tanner design tools, TOREX has developed the smallest converters possible without sacrificing functionality and performance....

Siemens EDA IC 全流程 Siemens EDA 全流程有一個豐富的環境，高度可配置且非常靈活，為混合信號設計人員提供了許多易用功能。該流程經過優化，適用於創建 22nm 的定制模擬 IC 或 “類比為頂層” 的混合訊號...

Improved Handling of Array Creation and Spacing in L-Edit Using Alignment Operations Tile2DArray icon now controls rows/columns when all...

By Srinivas Velivala Place and route (P&R) engineers are always on the lookout for ways to optimize their design flows to ensure designs...

By Pradeep Thiagarajan Having done IC development for over two decades, I can appreciate the complexities of foundry processes that...

Introduction The adoption of high-density advanced packaging (HDAP) continues to grow for all kinds of end-user applications. 2.5D...

Place and route (P&R) engineers at MaxLinear strive to achieve high reliability and manufacturability in their SoC designs, while also...